Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US11961516Application Date: 2007-12-20
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Publication No.: US07932580B2Publication Date: 2011-04-26
- Inventor: Mitsuru Soma , Hirotsugu Hata , Yoshimasa Amatatsu
- Applicant: Mitsuru Soma , Hirotsugu Hata , Yoshimasa Amatatsu
- Applicant Address: JP Osaka JP Gunma
- Assignee: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- Current Assignee: Sanyo Electric Co., Ltd.,Sanyo Semiconductor Co., Ltd.
- Current Assignee Address: JP Osaka JP Gunma
- Agency: Fish & Richardson P.C.
- Priority: JP2006-344759 20061221; JP2007-311597 20071130
- Main IPC: H01L27/082
- IPC: H01L27/082 ; H01L27/102 ; H01L29/70 ; H01L31/11

Abstract:
In the substrate and the epitaxial layer, isolation regions are formed to divide the substrate and the epitaxial layer into a plurality of element formation regions. Each of the isolation regions is formed by connecting first and second P type buried diffusion layers with a P type diffusion layer. By disposing the second P type buried diffusion layer between the first P type buried diffusion layer and the P type diffusion layer, a lateral diffusion width of the first P type buried diffusion layer is reduced. This structure allows a formation region of the isolation region to be reduced in size.
Public/Granted literature
- US20080150083A1 Semiconductor Device and Method of Manufacturing the Same Public/Granted day:2008-06-26
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