Invention Grant
US07932591B2 Stacked semiconductor package having flexible circuit board therein
有权
其中具有柔性电路板的堆叠半导体封装
- Patent Title: Stacked semiconductor package having flexible circuit board therein
- Patent Title (中): 其中具有柔性电路板的堆叠半导体封装
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Application No.: US11744196Application Date: 2007-05-03
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Publication No.: US07932591B2Publication Date: 2011-04-26
- Inventor: Chi-Tsung Chiu
- Applicant: Chi-Tsung Chiu
- Applicant Address: TW Kao-Hsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kao-Hsiung
- Agent Winston Hsu; Scott Margo
- Priority: TW95119250A 20060530
- Main IPC: H01L23/02
- IPC: H01L23/02
Abstract:
The present invention relates to a stacked semiconductor package having flexible circuit board therein. The semiconductor package comprises a substrate and a chip assembly. The chip assembly comprises at least a first chip, a second chip and a flexible circuit board. The second chip is disposed above the first chip, and is electrically connected to the first chip by the flexible circuit board. The chip assembly is electrically connected to the substrate. As a result, the interposer of prior art is omitted, the overall thickness of the stacked semiconductor package of the present invention is reduced, and the manufacturing procedure is simplified.
Public/Granted literature
- US20070291458A1 STACKED SEMICONDUCTOR PACKAGE HAVING FLEXIBLE CIRCUIT BOARD THEREIN Public/Granted day:2007-12-20
Information query
IPC分类:
