An electronic component sealing substrate capable of configuring an electronic apparatus in which the influence of electromagnetic coupling and radio frequency noises between an electrical connection path and a micro electronic mechanical system is suppressed is provided. An electronic component sealing substrate (4) for hermetically sealing a micro electronic mechanical system (4) of an electronic component (2) that includes a semiconductor substrate (5), the micro electronic mechanical system (3) formed on a main face of the semiconductor substrate (5), and an electrode (6) electrically connected to the micro electronic mechanical system (3), includes an insulating substrate (7) that has a first main face joined to the main face of the semiconductor substrate (5) so as to hermetically seal the micro electronic mechanical system (3), and a wiring conductor (8) that has an end extending to the first main face of the insulating substrate (7) and is electrically connected to the electrode (6) of the electronic component (2), and the end of the wiring conductor (8) is positioned outside a joined portion of the main face of the semiconductor substrate (5) and the first main face of the insulating substrate (7).