Invention Grant
- Patent Title: Electrical connecting structure and bonding structure
- Patent Title (中): 电连接结构和接合结构
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Application No.: US12129711Application Date: 2008-05-30
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Publication No.: US07932600B2Publication Date: 2011-04-26
- Inventor: Ngai Tsang , Kuo-Shu Kao
- Applicant: Ngai Tsang , Kuo-Shu Kao
- Applicant Address: TW Hsinchu TW Taoyuan TW Hsinchu TW Taipei County TW Tainan County TW Hsinchu TW Miao-Li County
- Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Dispalys Corp.
- Current Assignee: Taiwan TFT LCD Association,Chunghwa Picture Tubes, Ltd.,Au Optronics Corporation,Hannstar Display Corporation,Chi Mei Optoelectronics Corporation,Industrial Technology Research Institute,TPO Dispalys Corp.
- Current Assignee Address: TW Hsinchu TW Taoyuan TW Hsinchu TW Taipei County TW Tainan County TW Hsinchu TW Miao-Li County
- Agency: Jianq Chyun IP Office
- Priority: TW97104832A 20080212
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An electrical connecting structure including a conductive pad, a polymer bump and a patterned conductive layer is provided. The conductive pad is on a substrate and the polymer bump is disposed over the substrate. The patterned conductive layer is disposed on the polymer bump and electrically connects to the conductive pad, wherein the patterned conductive layer covers a portion of the polymer bump and exposes another portion of the polymer bump.
Public/Granted literature
- US20090200686A1 ELECTRICAL CONNECTING STRUCTURE AND BONDING STRUCTURE Public/Granted day:2009-08-13
Information query
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