Invention Grant
US07932730B2 System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
有权
用于检查电磁耦合模块和无线IC器件的系统以及使用该系统制造电磁耦合模块和无线IC器件的方法
- Patent Title: System for inspecting electromagnetic coupling modules and radio IC devices and method for manufacturing electromagnetic coupling modules and radio IC devices using the system
- Patent Title (中): 用于检查电磁耦合模块和无线IC器件的系统以及使用该系统制造电磁耦合模块和无线IC器件的方法
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Application No.: US12274400Application Date: 2008-11-20
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Publication No.: US07932730B2Publication Date: 2011-04-26
- Inventor: Yuya Dokai , Noboru Kato
- Applicant: Yuya Dokai , Noboru Kato
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2006-162675 20060612; JP2006-236776 20060831
- Main IPC: G01R31/02
- IPC: G01R31/02 ; G01R29/08
Abstract:
A system for inspecting an electromagnetic coupling module includes a radio IC chip and a feeder circuit board on which the radio IC chip is mounted, the feeder circuit board includes a feeder circuit including an inductance element. This inspecting system measures the electromagnetic coupling module by electromagnetically coupling a probe of a measuring device to the electromagnetic coupling module by at least one of electrostatic coupling and electromagnetic coupling. In addition, the electromagnetic coupling modules are manufactured using this inspecting system.
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