Invention Grant
- Patent Title: Coplanar coupled-fed multiband antenna for the mobile device
- Patent Title (中): 用于移动设备的共面耦合馈线多频带天线
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Application No.: US12232587Application Date: 2008-09-19
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Publication No.: US07932865B2Publication Date: 2011-04-26
- Inventor: Kin-Lu Wong , Chih-Hung Huang
- Applicant: Kin-Lu Wong , Chih-Hung Huang
- Applicant Address: TW Taipei Hsien
- Assignee: Acer Incorporated
- Current Assignee: Acer Incorporated
- Current Assignee Address: TW Taipei Hsien
- Agency: Jianq Chyun IP Office
- Priority: TW97116539A 20080505
- Main IPC: H01Q1/24
- IPC: H01Q1/24

Abstract:
The present invention is related to a coplanar coupled-fed multiband antenna for the mobile communication device. The antenna mainly comprises a dielectric substrate, a ground plane located on one surface of the dielectric substrate, and a radiating portion, a shorting metal portion, and a feeding portion, which are all on the same surface of the dielectric substrate near one edge of the ground plane. One end of the shorting metal portion is connected to the radiating portion, and the other end is connected to the ground plane. The feeding portion comprises a first feeding metal portion and a second feeding metal portion. The first feeding metal portion has a feeding point for the antenna. One end of the second feeding metal portion is connected to the radiating portion, and there is a gap between the second feeding metal portion and the first feeding metal portion.
Public/Granted literature
- US20090273521A1 Coplanar coupled-fed multiband antenna for the mobile device Public/Granted day:2009-11-05
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