Invention Grant
- Patent Title: Mirror device accommodated by liquid-cooled package
- Patent Title (中): 镜面装置采用液冷封装
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Application No.: US12291943Application Date: 2008-11-13
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Publication No.: US07933059B2Publication Date: 2011-04-26
- Inventor: Hirokazu Nishino , Yoshihiro Maeda , Fusao Ishii
- Applicant: Hirokazu Nishino , Yoshihiro Maeda , Fusao Ishii
- Applicant Address: JP JP
- Assignee: Silicon Quest Kabushiki-Kaisha,Olympus Corporation
- Current Assignee: Silicon Quest Kabushiki-Kaisha,Olympus Corporation
- Current Assignee Address: JP JP
- Agent Bo-In Lin
- Main IPC: G02B26/00
- IPC: G02B26/00
Abstract:
The present invention discloses a mirror device that comprises 1) a mirror element for modulating incident light emitted from a light source and for controlling the reflecting direction of incident light, and 2) a coolant flow channel for containing and flowing a liquid coolant through the flow channel to carry away heat generated in the mirror device.
Public/Granted literature
- US20090128935A1 Mirror device accommodated by liquid-cooled package Public/Granted day:2009-05-21
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