Invention Grant
- Patent Title: Multilayer electronic component and method for manufacturing multilayer electronic component
- Patent Title (中): 多层电子元件及其制造方法
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Application No.: US12055372Application Date: 2008-03-26
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Publication No.: US07933113B2Publication Date: 2011-04-26
- Inventor: Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
- Applicant: Akihiro Motoki , Kenichi Kawasaki , Makoto Ogawa , Shigeyuki Kuroda , Shunsuke Takeuchi , Hideyuki Kashio
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2007-083422 20070328; JP2007-101319 20070409
- Main IPC: H01G4/228
- IPC: H01G4/228

Abstract:
A method for manufacturing a laminated ceramic capacitor includes a step of preparing a laminate which has a first principal surface, a second principal surface, a first end surface, a second end surface, a first side surface, and a second side surface and which includes insulating layers and internal electrodes having end portions exposed at the first or second end surface; a step of forming external electrodes on the first and second end surfaces such that plating deposits are formed on the exposed end portions of the internal electrodes so as to be connected to each other; and a step of forming thick end electrodes electrically connected to the external electrodes such that a conductive paste is applied onto edge portions of the first and second principal surfaces and first and second side surfaces of the laminate and then baked.
Public/Granted literature
- US20080239617A1 MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING MULTILAYER ELECTRONIC COMPONENT Public/Granted day:2008-10-02
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