Invention Grant
- Patent Title: Board unit and electronic apparatus
- Patent Title (中): 板单元和电子设备
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Application No.: US12369213Application Date: 2009-02-11
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Publication No.: US07933125B2Publication Date: 2011-04-26
- Inventor: Jie Wei , Keizou Takemura
- Applicant: Jie Wei , Keizou Takemura
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-075622 20080324
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A board unit comprises a board, a heat generating component mounted on a front surface of the board, a first heat transfer plate whose inner surface faces the front surface of the board and is received by the heat generating component, a heat insulating material that is superimposed on an outer surface of the first heat transfer plate and that insulates heat dissipation, a second heat transfer plate that continues to the first heat transfer plate and that defines a heat conducting surface and a heat receiver that is received by the heat conducting surface of the second heat transfer plate and that defines a flow path of a coolant.
Public/Granted literature
- US20090237883A1 BOARD UNIT AND ELECTRONIC APPARATUS Public/Granted day:2009-09-24
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