Invention Grant
- Patent Title: Solid state relay with internal heat sink
- Patent Title (中): 带内部散热器的固态继电器
-
Application No.: US12381384Application Date: 2009-03-11
-
Publication No.: US07933126B2Publication Date: 2011-04-26
- Inventor: Dipin Jain
- Applicant: Dipin Jain
- Applicant Address: US IL Palatine
- Assignee: Schneider Electric USA, Inc.
- Current Assignee: Schneider Electric USA, Inc.
- Current Assignee Address: US IL Palatine
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H01L23/34
Abstract:
A solid state relay having an internal heat sink for dissipating heat produced by a solid state switching device. The relay being enclosed within a nonmetallic housing and mountable on a DIN type rail system.
Public/Granted literature
- US20100232114A1 Solid state relay with internal heat sink Public/Granted day:2010-09-16
Information query
