Invention Grant
- Patent Title: Method and system for teaching reference position of semiconductor wafer in automated wafer handling manufacturing equipment
- Patent Title (中): 在自动晶片处理制造设备中教导半导体晶片的参考位置的方法和系统
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Application No.: US10516337Application Date: 2003-01-17
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Publication No.: US07933665B2Publication Date: 2011-04-26
- Inventor: Fumio Sakiya , Yasuhisa Sato , Tetsuya Nagao , Toshiyuki Ikeda
- Applicant: Fumio Sakiya , Yasuhisa Sato , Tetsuya Nagao , Toshiyuki Ikeda
- Applicant Address: JP Hiroshima
- Assignee: Rorze Corporation
- Current Assignee: Rorze Corporation
- Current Assignee Address: JP Hiroshima
- Agency: Oliff & Berridge, PLC
- Priority: JP2002-157393 20020530
- International Application: PCT/JP03/00381 WO 20030117
- International Announcement: WO03/101677 WO 20031211
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
In order to automate the positioning at respective ports at the start-up of an equipment in a semiconductor manufacturing equipment equipped with a positioning device and a carrying robot and enhance productivity, 2 points W1 and W2 at which the circumference of a disc-like object 47 such as a wafer and the locus 43 of a detection means cross are detected, and the center position A of a disc-like object is calculated using the specific point O on the perpendicular bisector 42 of the section of a line combining 2 points with these and the radius r of the disc-like object. Thereby, the carrying robot could carry out the positioning work and not only the correction of a carrying route but also the reference position teaching at the start-up of equipment could be automated using the result.
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