Invention Grant
- Patent Title: Method and system for a pattern layout split
- Patent Title (中): 图案布局拆分的方法和系统
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Application No.: US11671866Application Date: 2007-02-06
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Publication No.: US07934177B2Publication Date: 2011-04-26
- Inventor: Jaw-Jung Shin , King-Chang Shu , Tsai-Sheng Gau , Burn Jeng Lin
- Applicant: Jaw-Jung Shin , King-Chang Shu , Tsai-Sheng Gau , Burn Jeng Lin
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
A method for splitting a pattern layout including providing the pattern layout having features, checking the pattern layout to determine the features that require splitting, coloring the features that require splitting with a first and second color, resolving coloring conflicts by decomposing the feature with the coloring conflict and coloring the decomposed feature with the first and second color, and generating a first mask with features of the first color and a second mask with features of the second color.
Public/Granted literature
- US20080189672A1 Method and System For a Pattern Layout Split Public/Granted day:2008-08-07
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