Invention Grant
- Patent Title: Method for packaging micro electromechanical systems microphone
- Patent Title (中): 微机电系统麦克风包装方法
-
Application No.: US12319742Application Date: 2009-01-12
-
Publication No.: US07934306B2Publication Date: 2011-05-03
- Inventor: Kuo-Jung Wu
- Applicant: Kuo-Jung Wu
- Applicant Address: TW Taipei
- Assignee: Tong Hsing Electric Industries, Ltd.
- Current Assignee: Tong Hsing Electric Industries, Ltd.
- Current Assignee Address: TW Taipei
- Agency: Cooper & Dunham LLP
- Agent William E. Pelton, Esq.
- Main IPC: H04R31/00
- IPC: H04R31/00

Abstract:
A method for packaging micro electromechanical systems (MEMS) microphone has steps of providing a base, arranging and mounting multiple microphone component assemblies on the base, providing a frame, mounting the frame on the base, forming multiple microphone units, providing a cover; mounting the microphone units on the cover and forming multiple MEMS microphones. Therefore, the MEMS microphones can be produced once in large quantities to save production time and costs.
Public/Granted literature
- US20100175242A1 Method for packaging micro electromechanical systems microphone Public/Granted day:2010-07-15
Information query