Invention Grant
- Patent Title: Methods of fabricating exchange-coupling film, magnetoresistive element, and thin-film magnetic head
- Patent Title (中): 制造交换耦合膜，磁阻元件和薄膜磁头的方法
-
Application No.: US12003453Application Date: 2007-12-26
-
Publication No.: US07934309B2Publication Date: 2011-05-03
- Inventor: Keita Kawamori , Satoshi Miura
- Applicant: Keita Kawamori , Satoshi Miura
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oliff & Berridge, PLC
- Main IPC: G11B5/127
- IPC: G11B5/127
Abstract:
The method of fabricating an exchange-coupling film in accordance with the present invention comprises a multilayer body forming step of forming a multilayer body having an antiferromagnetic layer and a ferromagnetic layer laminated on the antiferromagnetic layer; and an annealing step of annealing the multilayer body in a magnetic field with a maximum temperature higher than a blocking temperature of the multilayer body by 15 to 60° C.
Public/Granted literature
- US20090165894A1 Methods of fabricating exchange-coupling film, magnetoresistive element, and thin-film magnetic head Public/Granted day:2009-07-02
Information query
IPC分类:
