Invention Grant
- Patent Title: Production method of an electronic circuit device
- Patent Title (中): 电子电路装置的制造方法
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Application No.: US12350992Application Date: 2009-01-09
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Publication No.: US07934312B2Publication Date: 2011-05-03
- Inventor: Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
- Applicant: Takuya Mayuzumi , Masahiro Sasaki , Kiyoomi Kadoya
- Applicant Address: JP Tokyo
- Assignee: Hitachi, Ltd.
- Current Assignee: Hitachi, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Crowell & Moring LLP
- Priority: JP2004-364824 20041216
- Main IPC: H05K3/30
- IPC: H05K3/30
Abstract:
An electronic circuit device comprises: a printed circuit board mounted with electronic components; a resin-molded portion formed of resin so disposed that the electronic components are covered therewith; a convex connector that has metal terminals for connection and is exposed from the resin-molded portion; and a sealing member wrapped around the resin-molded portion.
Public/Granted literature
- US20090119913A1 Electronic Circuit Device and Production Method of the Same Public/Granted day:2009-05-14
Information query
