Invention Grant
US07934314B2 Conductive film structure, fabrication method thereof, and conductive film type probe device for IC
有权
导电膜结构，其制造方法和用于IC的导电膜型探针装置
- Patent Title: Conductive film structure, fabrication method thereof, and conductive film type probe device for IC
- Patent Title (中): 导电膜结构，其制造方法和用于IC的导电膜型探针装置
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Application No.: US12323422Application Date: 2008-11-25
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Publication No.: US07934314B2Publication Date: 2011-05-03
- Inventor: Min-Chieh Chou , Tung-Chuan Wu , Jen-Hui Tsai , Hung-Yi Lin
- Applicant: Min-Chieh Chou , Tung-Chuan Wu , Jen-Hui Tsai , Hung-Yi Lin
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Priority: TW97117542A 20080513
- Main IPC: H05K3/02
- IPC: H05K3/02
Abstract:
A method for forming a conductive film structure is provided, which includes providing a flexible insulating substrate, forming a conductive film overlying the flexible insulating substrate, patterning the conductive film to form a plurality of micro-wires overlying the flexible insulating substrate, wherein the micro-wires are extended substantially parallel to each other, forming an insulating layer overlying the flexible insulating substrate and the micro-wires, and winding or folding the flexible insulating substrate along an axis substantially parallel to an extending direction of the micro-wires to form a conducting lump.
Public/Granted literature
- US20090284275A1 CONDUCTIVE FILM STRUCTURE, FABRICATION METHOD THEREOF, AND CONDUCTIVE FILM TYPE PROBE DEVICE FOR IC Public/Granted day:2009-11-19
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