Invention Grant
- Patent Title: Flip-top closure for composite and cardboard packaging
- Patent Title (中): 用于复合和纸板包装的翻盖封闭
-
Application No.: US10598008Application Date: 2005-02-16
-
Publication No.: US07934616B2Publication Date: 2011-05-03
- Inventor: Josef Felber
- Applicant: Josef Felber
- Applicant Address: CH Neuhausen Am Rheinfall
- Assignee: SIG Technology Ltd.
- Current Assignee: SIG Technology Ltd.
- Current Assignee Address: CH Neuhausen Am Rheinfall
- Agent Edwin D. Schindler
- Priority: CH0256/04 20040218
- International Application: PCT/CH2005/000089 WO 20050216
- International Announcement: WO2005/077769 WO 20050825
- Main IPC: B65D43/18
- IPC: B65D43/18

Abstract:
A flip-top closure for composite and cardboard packaging, which permits the automatic opening of a package by flipping open the lid of the closure, includes a frame base element, which is designed to be welded by its level underside to composite or card-board packaging, and has a continuous peripheral overhang that protrudes upwards in order to form a pouring neck with an interior opening. A cover that flips open and closes is fixed to the base element. A guide, or tongue, element is pivotally mounted on the base element extends over the interior expanse of the overhang and friction-fit elements act between the tongue, or guide, element and the cover to pivot the tongue downwardly by force when the cover is flipped open for tearing and pivoting away a piece of the packaging lying below the tongue or guide element.
Public/Granted literature
- US20070131689A1 Flip-top closure for composite and cardboard packaging Public/Granted day:2007-06-14
Information query