Invention Grant
US07934632B2 Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same
有权
用于制造用于宽引线框的半导体封装的装置和使用其构造半导体封装的方法
- Patent Title: Apparatus for manufacturing semiconductor package for wide lead frame and method of constructing semiconductor package using the same
- Patent Title (中): 用于制造用于宽引线框的半导体封装的装置和使用其构造半导体封装的方法
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Application No.: US12393651Application Date: 2009-02-26
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Publication No.: US07934632B2Publication Date: 2011-05-03
- Inventor: Sun Ha Hwang
- Applicant: Sun Ha Hwang
- Applicant Address: KR Chungcheongnam-Do
- Assignee: STS Semiconductor & Telecommunications Co., Ltd.
- Current Assignee: STS Semiconductor & Telecommunications Co., Ltd.
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: Greenlee Sullivan P.C.
- Priority: KR10-2008-0038989 20080425
- Main IPC: B23K37/00
- IPC: B23K37/00
Abstract:
An apparatus for manufacturing a semiconductor package includes an index rail transferring a lead frame in forward and backward directions, the lead frame having a first surface and a second surface that is opposite to the first surface, a loader portion connected to an end portion of the index rail and supplying the lead frame to the index rail, a frame driving portion connected to the opposite end portion of the end portion of the index rail and rotating the lead frame around a normal to the first surface, and a wire bonding portion electrically connecting the lead frame and a semiconductor chip attached to the lead frame supplied to the index rail using a wire bond.
Public/Granted literature
Information query
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