A method of manufacturing a recording head according to the present invention includes a plurality of steps to describe as follows. In a solder paste application step, solder paste bodies are partially applied onto a plurality of terminals. In a heating step, each of the plurality of solder paste bodies is heated, to thereby form a plurality of solder layers on the plurality of terminals. In a covering step, the plurality of terminals and the plurality of solder layers are covered by an uncured synthetic resin layer. In a contact step, a plurality of bumps formed in a bump forming step and the plurality of solder layers are contacted with each other, by pressing regions of the synthetic resin layer covering the solder layers and the bumps to each other. In a curing step, the uncured synthetic resin layer is cured.