Invention Grant
- Patent Title: Printhead integrated circuit comprising polymeric cover layer
- Patent Title (中): 包括聚合物覆盖层的打印头集成电路
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Application No.: US12505507Application Date: 2009-07-19
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Publication No.: US07934807B2Publication Date: 2011-05-03
- Inventor: Gregory John McAvoy , Kia Silverbrook , Emma Rose Kerr , Misty Bagnat , Vincent Patrick Lawlor
- Applicant: Gregory John McAvoy , Kia Silverbrook , Emma Rose Kerr , Misty Bagnat , Vincent Patrick Lawlor
- Applicant Address: AU Balmain, New South Wales
- Assignee: Silverbrook Research Pty Ltd
- Current Assignee: Silverbrook Research Pty Ltd
- Current Assignee Address: AU Balmain, New South Wales
- Main IPC: B41J2/04
- IPC: B41J2/04
Abstract:
A printhead integrated circuit comprises a substrate having drive circuitry and a plurality of nozzle assemblies positioned on the substrate. Each nozzle assembly has a moving portion moveable relative to a stationary portion for ejection of ink. The printhead integrated circuit is covered with a polymeric layer. The polymeric layer covers a gap defined between each moving portion and each stationary portion.
Public/Granted literature
- US20090278899A1 Printhead Integrated Circuit Comprising Polymeric Cover Layer Public/Granted day:2009-11-12
Information query
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