Invention Grant
- Patent Title: Inkjet printhead having conductive epoxy resin
- Patent Title (中): 喷墨打印头具有导电环氧树脂
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Application No.: US11531414Application Date: 2006-09-13
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Publication No.: US07934811B2Publication Date: 2011-05-03
- Inventor: Byung-ha Park , Young-ung Ha
- Applicant: Byung-ha Park , Young-ung Ha
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee: SAMSUNG Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Stanzione & Kim, LLP
- Priority: KR10-2005-0085203 20050913
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/145 ; B41J2/16 ; C08L63/00

Abstract:
An inkjet printhead includes an ink flow path including a nozzle through which ink is ejected and is formed of a conductive epoxy resin, the conductive epoxy resin is a hardening result of a conductive cross-linked polymer resist composition formed by actinic radiation, and the conductive cross-linked polymer resist composition includes (a) at least one epoxy precursor polymer selected from a phenol novolak precursor polymer and an alicyclic precursor polymer including glycidyl ether group, (b) a metal alkoxide compound represented by the following formula R′M(OR)n, where R′ refers to a functional group including an oxirane group or an oxetanyl group, R refers to a C1-10alkyl group, and M is a metal selected from the group consisting of Al, Ti, and Zr, (c) a cationic photoinitiator, and (d) a solvent. The inkjet printhead includes an ink flow path formed of a conductive epoxy resin and a trench formed around a heater of the inkjet printhead to dissipate residual heat generated by the heater.
Public/Granted literature
- US20070060675A1 INKJET PRINTHEAD HAVING CONDUCTIVE EPOXY RESIN Public/Granted day:2007-03-15
Information query
IPC分类: