Invention Grant
- Patent Title: Thermal sensor and measurement device using the same
- Patent Title (中): 热传感器和测量装置使用相同
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Application No.: US11632366Application Date: 2005-06-28
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Publication No.: US07934868B2Publication Date: 2011-05-03
- Inventor: Akiko Kubota , Kenji Tomonari , Toshiaki Kawanishi
- Applicant: Akiko Kubota , Kenji Tomonari , Toshiaki Kawanishi
- Applicant Address: JP Tokyo
- Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee: Mitsui Mining & Smelting Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Frommer Lawrence & Haug LLP
- Agent Ronald R. Santucci
- Priority: JP2004-208666 20040715
- International Application: PCT/JP2005/011791 WO 20050628
- International Announcement: WO2006/008920 WO 20060126
- Main IPC: G01K17/20
- IPC: G01K17/20 ; G01N25/00 ; G01N25/28 ; G01N25/40

Abstract:
A thermal sensor in which, when an object to be measured is a water-based liquid, attachment of air bubbles to the external surface of the sensor is reduced to improve measurement accuracy. The thermal sensor has a sensing element (21a) including a heat producing body and a temperature sensing body, a resin mold (23) for sealing the sensing element (21a), and a heat transmission member (21c) for transmitting heat between the sensing element (21a) and a water-based object to be measured. A part of the heat transmission member (21c) is exposed from the resin mold (23) to form an exposed surface section. A hydrophilic film (50) formed of a silicon oxide film is applied to the exposed surface section and to that part of the surface of the resin mold which is positioned around the exposed surface section.
Public/Granted literature
- US20070237206A1 Thermal Sensor and Measurement Device Using the Same Public/Granted day:2007-10-11
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