Invention Grant
- Patent Title: Camera module, fabricating method and cleaning method thereof
- Patent Title (中): 相机模块,其制造方法和清洁方法
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Application No.: US12466203Application Date: 2009-05-14
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Publication No.: US07934879B2Publication Date: 2011-05-03
- Inventor: Hsiang-Kai Liao , Po-Chun Chang
- Applicant: Hsiang-Kai Liao , Po-Chun Chang
- Applicant Address: TW Taipei
- Assignee: Primax Electronics Ltd.
- Current Assignee: Primax Electronics Ltd.
- Current Assignee Address: TW Taipei
- Agency: Kirton & McConkie
- Agent Evan R. Witt
- Priority: TW98107286A 20090306
- Main IPC: G03B17/00
- IPC: G03B17/00 ; B08B9/00 ; G01R35/00

Abstract:
A camera module includes a lens module, an image sensor, a circuit board for supporting the image sensor, and a lens holder for connecting the lens module and the circuit board. A method for fabricating the camera module includes the following steps. Firstly, at least one cleaning hole is created in the lens holder, and the at least one cleaning hole is filled with a removable sealing stuff. Then, the printed circuit board, the image sensor, the lens holder and the lens module of the camera module are combined together. Then, a testing procedure is performed to detect whether any pollutant is present within the assembled camera module. Once any pollutant within the assembled camera module is detected, the sealing stuff is removed from the at least one cleaning hole, a cleaning procedure is done to remove the pollutant, and the at least one cleaning hole is sealed again.
Public/Granted literature
- US20100224216A1 CAMERA MODULE, FABRICATING METHOD AND CLEANING METHOD THEREOF Public/Granted day:2010-09-09
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