Invention Grant
US07934940B2 Ground connection comprising a vibrational damper for electronic devices
有权
接地连接包括用于电子设备的振动阻尼器
- Patent Title: Ground connection comprising a vibrational damper for electronic devices
- Patent Title (中): 接地连接包括用于电子设备的振动阻尼器
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Application No.: US12524814Application Date: 2008-01-29
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Publication No.: US07934940B2Publication Date: 2011-05-03
- Inventor: Edward Kotowicz
- Applicant: Edward Kotowicz
- Applicant Address: DE Hannover
- Assignee: Continental Automotive GmbH
- Current Assignee: Continental Automotive GmbH
- Current Assignee Address: DE Hannover
- Agent Laurence A. Greenberg; Werner H. Stemer
- Priority: DE102007006177 20070207
- International Application: PCT/EP2008/051042 WO 20080129
- International Announcement: WO2008/095830 WO 20080814
- Main IPC: H01R13/648
- IPC: H01R13/648
Abstract:
A ground connection system for electronic components that are exposed to vibrations, wherein the system is mounted on a ground carrier, has a metal bushing and an elastic damping element. One or more electrically conductive spiral springs are fitted inside the metal bushing together with the elastic damping element. The springs form an electrically conductive connection between the electronic component and the ground carrier.
Public/Granted literature
- US20100130037A1 GROUND CONNECTION COMPRISING A VIBRATIONAL DAMPER FOR ELECTRONIC DEVICES Public/Granted day:2010-05-27
Information query
