Invention Grant
- Patent Title: Electrical connecting apparatus
- Patent Title (中): 电气连接装置
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Application No.: US12296430Application Date: 2007-03-22
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Publication No.: US07934944B2Publication Date: 2011-05-03
- Inventor: Kazuhito Hamada , Takashi Akiniwa , Satoshi Narita
- Applicant: Kazuhito Hamada , Takashi Akiniwa , Satoshi Narita
- Applicant Address: JP Tokyo
- Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee: Kabushiki Kaisha Nihon Micronics
- Current Assignee Address: JP Tokyo
- Agency: Graybeal Jackson LLP
- Agent Bryan A. Santarelli
- Priority: JP2006-105924 20060407
- International Application: PCT/JP2007/056751 WO 20070322
- International Announcement: WO2007/116795 WO 20071018
- Main IPC: H01R11/18
- IPC: H01R11/18

Abstract:
An embodiment of an electrical connecting apparatus comprises a support board having an upper surface and a lower surface, a block having an attachment surface directing downward and attached to the support board in a state where at least the attachment surface is located below the support board, a flexible circuit board having a contactor area in which a plurality of contactors are arranged and an outside area around the contactor area and attached at part of the outside area to the lower surface of the support board in a state where at least the contactor area is opposed to the attachment surface of the block, and a reference mark member having a lower end surface and a reference mark for positioning provided on the lower end surface and attached to the block in a state where the lower end surface is exposed to the lower side of the circuit board. Accordingly, the measurement accuracy of the probe tip position is heightened.
Public/Granted literature
- US20100029099A1 ELECTRICAL CONNECTING APPARATUS Public/Granted day:2010-02-04
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