Invention Grant
- Patent Title: Low profile contact
- Patent Title (中): 低调联系
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Application No.: US12436978Application Date: 2009-05-07
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Publication No.: US07934961B2Publication Date: 2011-05-03
- Inventor: Kasthuri Sankar Damodharan , Robert Wayne Walker
- Applicant: Kasthuri Sankar Damodharan , Robert Wayne Walker
- Applicant Address: US PA Berwyn
- Assignee: Tyco Electronics Corporation
- Current Assignee: Tyco Electronics Corporation
- Current Assignee Address: US PA Berwyn
- Main IPC: H01R4/48
- IPC: H01R4/48

Abstract:
The invention provides a modular housing assembly system having a first housing assembly and second housing assembly. The first housing assembly has first contacts mounted thereon. The first contacts have elongated contact sections. The second housing assembly has second contacts mounted thereon. Each of the second contacts has more than one resilient contact sections spaced apart from each other along the longitudinal axis of the second contact. As the first housing assembly and the second housing assembly are moved into engagement, at least one resilient contact section of each of the second contacts are positioned in electrical engagement with the elongated contact sections of the first contacts. This configuration of the first contacts and second contacts allows the first contacts to make electrical engagement with second contacts of housing assembly or second contacts of housing assembly even though the housing assemblies have different configurations which causes the second contacts to be positioned at a different height than second contacts.
Public/Granted literature
- US20090311922A1 LOW PROFILE CONTACT Public/Granted day:2009-12-17
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