Invention Grant
- Patent Title: Prosthesis removal cutting guide, cutting tool and method
- Patent Title (中): 假体去除切割导轨，切削刀具及方法
-
Application No.: US10176934Application Date: 2002-06-21
-
Publication No.: US07935118B2Publication Date: 2011-05-03
- Inventor: Tim Vendrely , M. Kathleen Willison , Lowry Barnes
- Applicant: Tim Vendrely , M. Kathleen Willison , Lowry Barnes
- Applicant Address: US IN Warsaw
- Assignee: DePuy Products, Inc.
- Current Assignee: DePuy Products, Inc.
- Current Assignee Address: US IN Warsaw
- Agency: Maginot, Moore & Beck
- Main IPC: A61F5/00
- IPC: A61F5/00
Abstract:
A kit for removal of bone adjacent to an implanted prosthesis. The kit includes a guide for cooperation with the prosthesis and a tool constrainable by the guide for removal of the bone. The guide may include a first portion of the guide that is co-operable with the tool and a second portion of the guide that is co-operable with the prosthesis.
Public/Granted literature
- US20030236525A1 Prosthesis removal cutting guide, cutting tool and method Public/Granted day:2003-12-25
Information query
