Invention Grant
- Patent Title: Method for manufacturing copper-based nanoparticles
- Patent Title (中): 铜基纳米粒子的制造方法
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Application No.: US11987162Application Date: 2007-11-28
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Publication No.: US07935170B2Publication Date: 2011-05-03
- Inventor: Byung-Ho Jun , Jae-Woo Joung , Joon-Rak Choi
- Applicant: Byung-Ho Jun , Jae-Woo Joung , Joon-Rak Choi
- Applicant Address: KR Gyunggi-Do
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2007-0098392 20070928
- Main IPC: B22F9/24
- IPC: B22F9/24

Abstract:
The present invention relates to a method for manufacturing copper-based nanoparticles, in particular, to a method for manufacturing copper-based nanoparticles, wherein the method includes producing CuO nanoparticles by mixing CuO micropowder and alkylamine in a nonpolar solvent and heating the mixture at 60-300° C.; and producing copper-based nanoparticles by mixing a capping molecule and a reducing agent with the CuO nanoparticles and heating the mixture at 60-120° C.According to the present invention, copper-based nanoparticles can be synthesized using CuO, but not requiring any inorganic reducing agent, in a high yield and a high concentration, so that it allows mass production and easy controlling to desired oxidation number of nanoparticles.
Public/Granted literature
- US20100282022A1 Method for manufaturing copper-based nanoparticles Public/Granted day:2010-11-11
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