Invention Grant
- Patent Title: Vertical thermal processing apparatus and method of using the same
- Patent Title (中): 垂直热处理装置及其使用方法
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Application No.: US11660898Application Date: 2005-08-24
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Publication No.: US07935188B2Publication Date: 2011-05-03
- Inventor: Wataru Nakajima , Takuya Oikawa , Hisashi Inoue
- Applicant: Wataru Nakajima , Takuya Oikawa , Hisashi Inoue
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Smith, Gambrell & Russell, LLP
- Priority: JP2004-246578 20040826
- International Application: PCT/JP2005/015367 WO 20050824
- International Announcement: WO2006/022303 WO 20060302
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/54

Abstract:
The invention is a vertical thermal processing apparatus including: a processing container that contains an object to be processed; a main heater provided so as to surround the processing container, the main heater being capable of heating the processing container and having a rapid cooling function; a gas-discharging part formed at an upper portion of the processing container, the gas-discharging part being bent; an auxiliary heater provided so as to heat the gas-discharging part; a moving mechanism for evacuating the auxiliary heater away from the gas-discharging part during a rapid cooling process of the main heater; and a forcibly gas-discharging mechanism for forcibly discharging an atmospheric gas in a vicinity of the gas-discharging part.
Public/Granted literature
- US20080187652A1 Vertical Thermal Processing Apparatus and Method of Using the Same Public/Granted day:2008-08-07
Information query
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