Invention Grant
- Patent Title: Electroplating apparatus and method based on an array of anodes
- Patent Title (中): 基于阳极阵列的电镀设备和方法
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Application No.: US11435213Application Date: 2006-05-16
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Publication No.: US07935240B2Publication Date: 2011-05-03
- Inventor: Saravjeet Singh , Manoocher Birang , Nicolay Y. Kovarsky , Aron Rosenfeld
- Applicant: Saravjeet Singh , Manoocher Birang , Nicolay Y. Kovarsky , Aron Rosenfeld
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson & Sheridan, LLP
- Main IPC: C25D5/00
- IPC: C25D5/00 ; C25D7/12 ; C25D17/12
Abstract:
The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin configured to retain an electrolyte, a contact ring configured to support the substrate and contact the substrate electrically, and an anode assembly disposed in the fluid basin, wherein the anode assembly comprises a plurality of anode elements arranged in rows.
Public/Granted literature
- US20070068819A1 Electroplating apparatus based on an array of anodes Public/Granted day:2007-03-29
Information query
