Invention Grant
- Patent Title: Resin moldings and conductive resin composition
- Patent Title (中): 树脂模制品和导电树脂组合物
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Application No.: US10553209Application Date: 2004-04-16
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Publication No.: US07935275B2Publication Date: 2011-05-03
- Inventor: Takaaki Miyoshi , Kazuya Noda , Mitsuhiro Horio , Yuuji Yoshinaga
- Applicant: Takaaki Miyoshi , Kazuya Noda , Mitsuhiro Horio , Yuuji Yoshinaga
- Applicant Address: JP Tokyo
- Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee: Asahi Kasei Chemicals Corporation
- Current Assignee Address: JP Tokyo
- Agency: Staas & Halsey LLP
- Priority: JP2003-113589 20030418; JP2003-119814 20030424
- International Application: PCT/JP2004/005464 WO 20040416
- International Announcement: WO2004/092275 WO 20041028
- Main IPC: C08K3/34
- IPC: C08K3/34 ; C08K7/04 ; C08L79/00 ; C08L71/12

Abstract:
A shaped resin article comprising a polyamide (A) (comprising at least two different polyamide components), a polyphenylene ether (B) and a partially hydrogenated block copolymer (C) (obtained by partially hydrogenating a block copolymer comprising an aromatic vinyl polymer block and a conjugated diene polymer block) including a block copolymer (C-1) having a number average molecular weight of from 200,000 to 300,000, wherein (A) is present as a continuous phase in which (B) is dispersed to form a dispersed phase, and (C) is present in the continuous phase of (A) and/or the dispersed phase of (B), wherein the surface area of the polyamide (A) exposed on the overall surface of the shaped resin article is at least 80%, based on the surface area of the shaped resin article. A conductive resin composition comprising a polyamide (A), a polyphenylene ether (B), a partially hydrogenated block copolymer (C) comprising an aromatic vinyl polymer block and a conjugated diene polymer block, a conductive carbonaceous material (D) and wollastonite particles (E).
Public/Granted literature
- US20060199903A1 Resin moldings and conductive resin composition Public/Granted day:2006-09-07
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