Invention Grant
- Patent Title: Injection molding method and injection molding apparatus
- Patent Title (中): 注射成型法和注射成型装置
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Application No.: US11604869Application Date: 2006-11-28
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Publication No.: US07935293B2Publication Date: 2011-05-03
- Inventor: Tatsuo Ito , Daiichiro Kawashima , Kazuo Takeda
- Applicant: Tatsuo Ito , Daiichiro Kawashima , Kazuo Takeda
- Applicant Address: JP Aichi-pref.
- Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee: Toyoda Gosei Co., Ltd.
- Current Assignee Address: JP Aichi-pref.
- Agency: Posz Law Group, PLC
- Priority: JP2005-345555 20051130; JP2005-345556 20051130
- Main IPC: B29C45/00
- IPC: B29C45/00

Abstract:
An injection molding apparatus includes a forming mold provided with a gas inlet through which a gas is introduced into an area between a rear molding surface in a cavity and a resin material inside the cavity. A plurality of the gas inlets is provided along a passage direction of the resin material in the cavity. In injection molding the resin molded article, a molten resin material is introduced into the cavity from a resin inlet and, when filling the inside of the cavity with the resin material, the introduction of the gas is sequentially started, beginning with a gas inlet provided in an area inside the cavity which is first filled with the resin material, thereby sequentially pressing the relevant resin material against a front molding surface of the cavity.
Public/Granted literature
- US20070120296A1 Injection molding method and injection molding apparatus Public/Granted day:2007-05-31
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