Invention Grant
- Patent Title: Method of thermoforming
- Patent Title (中): 热成型方法
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Application No.: US11194303Application Date: 2005-08-01
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Publication No.: US07935301B2Publication Date: 2011-05-03
- Inventor: Frank M. Hofmeister , Bobby Ayers , Nathaneal R. Miranda , Cindy T. Price
- Applicant: Frank M. Hofmeister , Bobby Ayers , Nathaneal R. Miranda , Cindy T. Price
- Applicant Address: US SC Duncan
- Assignee: Cryovac, Inc.
- Current Assignee: Cryovac, Inc.
- Current Assignee Address: US SC Duncan
- Agent Daniel B. Ruble
- Main IPC: B29C51/00
- IPC: B29C51/00 ; B29C51/08 ; B29C51/14 ; B32B27/00 ; B32B27/34
Abstract:
A method of thermoforming comprises the steps of providing a film, heating the film, and forming the heated film onto a mold. The film comprises a propylene/ethylene copolymer skin layer having a melting point of from about 130° C. to about 150° C. and a interior polyamide layer having a melting point of from about 125° C. to about 230° C.
Public/Granted literature
- US20070026250A1 Method of thermoforming Public/Granted day:2007-02-01
Information query
