Invention Grant
- Patent Title: Process for forming a quantum-dot particle layer on a substrate
- Patent Title (中): 在基板上形成量子点粒子层的工艺
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Application No.: US12494706Application Date: 2009-06-30
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Publication No.: US07935388B2Publication Date: 2011-05-03
- Inventor: Hsueh-Shih Chen , Dai-Luon Lo , Gwo-Yang Chang , Chien-Ming Chen
- Applicant: Hsueh-Shih Chen , Dai-Luon Lo , Gwo-Yang Chang , Chien-Ming Chen
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Bacon & Thomas, PLLC
- Priority: TW93125331A 20040823
- Main IPC: H01L21/00
- IPC: H01L21/00

Abstract:
A method for manufacturing a quantum-dot element utilizes a reaction chamber for evaporating or sputtering at least one electrode layer or at least one buffer layer on a substrate. A substrate-supporting base is located inside the reaction chamber for fixing the substrate. An atomizer has a gas inlet and a sample inlet. More specifically, the gas inlet and the sample inlet feed the atomizer respectively with a gas and a precursor solution having a plurality of functionalized quantum dots, and thereby form a quantum-dot layer on the substrate. The method for manufacturing a quantum-dot element forms a quantum dot layer with uniformly distributed quantum dots and integrates the processes for forming the quantum-dot layer, the buffer layer, and the electrode layer together in the same chamber.
Public/Granted literature
- US20090263580A1 APPARATUS FOR MANUFACTURING A QUANTUM-DOT ELEMENT Public/Granted day:2009-10-22
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