Invention Grant
US07935393B2 Method and system for improving sidewall coverage in a deposition system
有权
用于改善沉积系统中侧壁覆盖度的方法和系统
- Patent Title: Method and system for improving sidewall coverage in a deposition system
- Patent Title (中): 用于改善沉积系统中侧壁覆盖度的方法和系统
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Application No.: US11835210Application Date: 2007-08-07
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Publication No.: US07935393B2Publication Date: 2011-05-03
- Inventor: Shigeru Mizuno , Takashi Sakuma , Yasushi Mizusawa
- Applicant: Shigeru Mizuno , Takashi Sakuma , Yasushi Mizusawa
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Main IPC: C23C14/00
- IPC: C23C14/00 ; H05H1/24
Abstract:
Embodiments of a method and system for improving the consistency of a layer or a plurality of layers with a desired profile in a deposition system are generally described herein. Other embodiments may be described and claimed.
Public/Granted literature
- US20090041950A1 METHOD AND SYSTEM FOR IMPROVING SIDEWALL COVERAGE IN A DEPOSITION SYSTEM Public/Granted day:2009-02-12
Information query
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