Invention Grant
- Patent Title: Layer arrangement for the formation of a coating on a surface of a substrate, coating method, and substrate with a layer arrangement
- Patent Title (中): 用于在基板的表面上形成涂层的层布置,涂布方法和具有层布置的基板
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Application No.: US11580571Application Date: 2006-10-13
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Publication No.: US07935426B2Publication Date: 2011-05-03
- Inventor: Joerg Vetter
- Applicant: Joerg Vetter
- Applicant Address: DE Bergisch-Gladbach
- Assignee: Sulzer Metaplas GmbH
- Current Assignee: Sulzer Metaplas GmbH
- Current Assignee Address: DE Bergisch-Gladbach
- Agency: Kilpatrick Townsend & Stockton LLP
- Priority: EP05405620 20051104
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B32B9/00 ; C23C14/06 ; C23C14/35 ; C23C14/24 ; C09D1/00

Abstract:
The invention relates to a layer arrangement (1) for the formation of a coating on a surface (2) of a substrate (3), in particular on the surface (2) of a tool (3), wherein the layer arrangement comprises at least one hard layer (4, 5, 6, 7, 8) having the composition SiaBbMecNuCvOw with a,b>0 and 33 at %>c ≧0, preferably 25 at %>c≧0, in particular 10 at %>c≧0 and u,v,w≧0, and Me being a metal. Furthermore, the invention relates to a coating method for depositing a layer arrangement (1), as well as to a substrate (3), in particular a tool (3) or a wearing part (3) having a layer arrangement (1) according to the invention.
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