Invention Grant
US07935430B2 Bonding structure of substrate and component and method of manufacturing the same 有权
基材和组分的粘合结构及其制造方法

Bonding structure of substrate and component and method of manufacturing the same
Abstract:
A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains at least spherical metal powder and flake metal powder. The low melting point solder is infiltrated from the surface of the electrode into the electrode.
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