Invention Grant
- Patent Title: Bonding structure of substrate and component and method of manufacturing the same
- Patent Title (中): 基材和组分的粘合结构及其制造方法
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Application No.: US11553387Application Date: 2006-10-26
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Publication No.: US07935430B2Publication Date: 2011-05-03
- Inventor: Hiroki Suzuki , Masato Uehara
- Applicant: Hiroki Suzuki , Masato Uehara
- Applicant Address: JP Tokyo
- Assignee: Alps Electric Co., Ltd.
- Current Assignee: Alps Electric Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Brinks Hofer Gilson & Lione
- Priority: JP2005-315931 20051031
- Main IPC: B32B15/08
- IPC: B32B15/08 ; B32B15/16 ; B23K1/00 ; B23K1/19 ; B22F7/02 ; H01L23/14

Abstract:
A bonding structure and method of manufacturing the same are provided. The bonding structure of a substrate and a component include an electrode formed of metal powder and a resin component on the substrate. A low melting point solder that bonds the component to the electrode. The metal powder contains at least spherical metal powder and flake metal powder. The low melting point solder is infiltrated from the surface of the electrode into the electrode.
Public/Granted literature
- US20070102487A1 BONDING STRUCTURE OF SUBSTRATE AND COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2007-05-10
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