Invention Grant
US07935519B2 DNA chip, DNA chip kit, and method of manufacturing the DNA chip
有权
DNA芯片,DNA芯片套件和DNA芯片的制造方法
- Patent Title: DNA chip, DNA chip kit, and method of manufacturing the DNA chip
- Patent Title (中): DNA芯片,DNA芯片套件和DNA芯片的制造方法
-
Application No.: US11790351Application Date: 2007-04-25
-
Publication No.: US07935519B2Publication Date: 2011-05-03
- Inventor: Won-sun Kim , Sung-min Chi , Jung-hwan Hah , Kyoung-seon Kim
- Applicant: Won-sun Kim , Sung-min Chi , Jung-hwan Hah , Kyoung-seon Kim
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Cantor Colburn LLP
- Priority: KR10-2006-0039703 20060502
- Main IPC: C12M1/34
- IPC: C12M1/34 ; C12Q1/68

Abstract:
A DNA chip includes a substrate, at least one first electrode and at least one second electrode on the substrate, the first electrode and the second electrode being opposite to and separated from each other, multiple oligonucleotide probes, one end of the oligonucleotide probes being immobilized on the first electrode, and a charge-carrier transport layer on the second electrode, the charge-carrier layer contacting an other end of the oligonucleotide probes.
Public/Granted literature
- US20070259418A1 DNA chip, DNA chip kit, and method of manufacturing the DNA chip Public/Granted day:2007-11-08
Information query