Invention Grant
- Patent Title: Method and system for sealing a substrate
- Patent Title (中): 密封基材的方法和系统
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Application No.: US12628024Application Date: 2009-11-30
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Publication No.: US07935555B2Publication Date: 2011-05-03
- Inventor: Philip D Floyd
- Applicant: Philip D Floyd
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee: QUALCOMM MEMS Technologies, Inc.
- Current Assignee Address: US CA San Diego
- Agency: Knobbe, Martens, Olson & Bear LLP
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A method of sealing a microelectromechanical system (MEMS) device from ambient conditions is described. The MEMS device is formed on a substrate and a substantially hermetic seal is formed as part of the MEMS device manufacturing process. The method may include forming a metal seal on the substrate proximate to a perimeter of the MEMS device using a method such as photolithography. The metal seal is formed on the substrate while the MEMS device retains a sacrificial layer between conductive members of MEMS elements, and the sacrificial layer is removed after formation of the seal and prior to attachment of a backplane.
Public/Granted literature
- US20100072595A1 METHOD AND SYSTEM FOR SEALING A SUBSTRATE Public/Granted day:2010-03-25
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