Invention Grant
- Patent Title: Microelectromechanical system and process of making the same
- Patent Title (中): 微机电系统及其制造过程
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Application No.: US11845780Application Date: 2007-08-27
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Publication No.: US07935556B2Publication Date: 2011-05-03
- Inventor: Li-Ken Yeh , I-Hsiang Chiu
- Applicant: Li-Ken Yeh , I-Hsiang Chiu
- Applicant Address: TW Hsinchu
- Assignee: Memsmart Semiconductor Corp.
- Current Assignee: Memsmart Semiconductor Corp.
- Current Assignee Address: TW Hsinchu
- Agency: CKC & Partners Co., Ltd.
- Main IPC: H01L21/00
- IPC: H01L21/00
Abstract:
A micro electromechanical system and a fabrication method thereof, which has trenches formed on a substrate to prevent circuits from interfering each other, and to prevent over-etching of the substrate when releasing a microstructure.
Public/Granted literature
- US20090057817A1 Microelectromechanical System and Process of Making the Same Public/Granted day:2009-03-05
Information query
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