Invention Grant
- Patent Title: Electronic devices
- Patent Title (中): 电子设备
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Application No.: US10538857Application Date: 2003-12-12
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Publication No.: US07935565B2Publication Date: 2011-05-03
- Inventor: Thomas Meredith Brown , Henning Sirringhaus , John Devin Mackenzie
- Applicant: Thomas Meredith Brown , Henning Sirringhaus , John Devin Mackenzie
- Applicant Address: GB Cambridge
- Assignee: Plastic Logic Limited
- Current Assignee: Plastic Logic Limited
- Current Assignee Address: GB Cambridge
- Agency: Sughrue Mion, PLLC
- Priority: GB0229191.2 20021214
- International Application: PCT/GB03/05430 WO 20031212
- International Announcement: WO2004/055919 WO 20040701
- Main IPC: H01L51/40
- IPC: H01L51/40
Abstract:
A method for forming an electronic device having a multilayer structure, comprising: embossing a surface of a substrate so as to depress first and second regions of the substrate relative to at least a third region of the substrate; depositing conductive or semiconductive material from solution onto the first and second regions of the substrate so as to form a first electrode on the first region and a second electrode on the second region, wherein the electrodes are electrically insulated from each other by the third region.
Public/Granted literature
- US20060160276A1 Electronic devices Public/Granted day:2006-07-20
Information query
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