The electronic device comprises a first substrate 10 with an electric circuit element formed in a predetermined region of one primary surface, a second substrate 12 formed, opposed to said one primary surface of the first substrate 10, sealing portions 26, 40 formed between the first substrate 10 and the second substrate 12, enclosing the predetermined region of the first substrate 10, and an adhesion layer 42 formed on the side surfaces of the sealing parts 26, 40. The adhesion layer is formed on the side surfaces of the first sealing structure 26 on the side of the first substrate 10 and the second sealing structure 40 on the side of the second substrate 12, whereby when the first sealing structure 26 and the second sealing structure 40 are bonded to each other, the adhesion between the first sealing structure 26 and the second sealing structure 40 can be sufficiently ensured.