Invention Grant
- Patent Title: Method of forming a semiconductor package and structure therefor
- Patent Title (中): 形成半导体封装的方法及其结构
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Application No.: US12098813Application Date: 2008-04-07
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Publication No.: US07935575B2Publication Date: 2011-05-03
- Inventor: Stephen St. Germain , Roger M. Arbuthnot , Frank Tim Jones
- Applicant: Stephen St. Germain , Roger M. Arbuthnot , Frank Tim Jones
- Applicant Address: US AZ Phoenix
- Assignee: Semiconductor Components Industries, LLC
- Current Assignee: Semiconductor Components Industries, LLC
- Current Assignee Address: US AZ Phoenix
- Agent Robert F. Hightower
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/58
Abstract:
In one embodiment, a semiconductor package is formed to include a leadframe that includes a plurality of die attach areas for attaching a semiconductor die to the leadframe. The leadframe is positioned to overlie another leadframe that forms some of the external terminals or leads of the package.
Public/Granted literature
- US20090250794A1 METHOD OF FORMING A SEMICONDUCTOR PACKAGE AND STRUCTURE THEREFOR Public/Granted day:2009-10-08
Information query
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