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US07935615B2 III-V nitride semiconductor substrate and its production method 有权
III-V族氮化物半导体衬底及其制造方法

  • Patent Title: III-V nitride semiconductor substrate and its production method
  • Patent Title (中): III-V族氮化物半导体衬底及其制造方法
  • Application No.: US11856926
    Application Date: 2007-09-18
  • Publication No.: US07935615B2
    Publication Date: 2011-05-03
  • Inventor: Masatomo Shibata
  • Applicant: Masatomo Shibata
  • Applicant Address: JP Tokyo
  • Assignee: Hitachi Cable, Ltd.
  • Current Assignee: Hitachi Cable, Ltd.
  • Current Assignee Address: JP Tokyo
  • Agency: Sughrue Mion, PLLC
  • Priority: JP2003-304078 20030828; JP2003-356699 20031016
  • Main IPC: H01L21/20
  • IPC: H01L21/20
III-V nitride semiconductor substrate and its production method
Abstract:
A self-supported III-V nitride semiconductor substrate having a substantially uniform carrier concentration distribution in a surface layer existing from a top surface to a depth of at least 10 μm is produced by growing a III-V nitride semiconductor crystal while forming a plurality of projections on a crystal growth interface at the initial or intermediate stage of crystal growth; conducting the crystal growth until recesses between the projections are buried, so that the crystal growth interface becomes flat; and continuing the crystal growth to a thickness of 10 μm or more while keeping the crystal growth interface flat.
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