Invention Grant
US07935615B2 III-V nitride semiconductor substrate and its production method
有权
III-V族氮化物半导体衬底及其制造方法
- Patent Title: III-V nitride semiconductor substrate and its production method
- Patent Title (中): III-V族氮化物半导体衬底及其制造方法
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Application No.: US11856926Application Date: 2007-09-18
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Publication No.: US07935615B2Publication Date: 2011-05-03
- Inventor: Masatomo Shibata
- Applicant: Masatomo Shibata
- Applicant Address: JP Tokyo
- Assignee: Hitachi Cable, Ltd.
- Current Assignee: Hitachi Cable, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2003-304078 20030828; JP2003-356699 20031016
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
A self-supported III-V nitride semiconductor substrate having a substantially uniform carrier concentration distribution in a surface layer existing from a top surface to a depth of at least 10 μm is produced by growing a III-V nitride semiconductor crystal while forming a plurality of projections on a crystal growth interface at the initial or intermediate stage of crystal growth; conducting the crystal growth until recesses between the projections are buried, so that the crystal growth interface becomes flat; and continuing the crystal growth to a thickness of 10 μm or more while keeping the crystal growth interface flat.
Public/Granted literature
- US20080014723A1 III-V NITRIDE SEMICONDUCTOR SUBSTRATE AND ITS PRODUCTION METHOD Public/Granted day:2008-01-17
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