Invention Grant
- Patent Title: Support with solder ball elements and a method for populating substrates with solder balls
- Patent Title (中): 支持焊球元件和用焊球填充基板的方法
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Application No.: US10565259Application Date: 2005-05-17
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Publication No.: US07935622B2Publication Date: 2011-05-03
- Inventor: Michael Bauer , Thomas Bemmerl , Edward Fuergut , Simon Jerebic , Herman Vilsmeier
- Applicant: Michael Bauer , Thomas Bemmerl , Edward Fuergut , Simon Jerebic , Herman Vilsmeier
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, P.L.L.C.
- Priority: DE102004025279 20040519
- International Application: PCT/DE2005/000892 WO 20050517
- International Announcement: WO2005/115072 WO 20051201
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied on one side, the layer of adhesive losing its adhesive force to the greatest extent when irradiated. The support has solder ball elements, which are arranged closely packed in rows and columns on the layer of adhesive in a prescribed pitch for a semiconductor chip or a semiconductor component.
Public/Granted literature
- US20070052112A1 Support with solder ball elements and a method for populating substrates with solder balls Public/Granted day:2007-03-08
Information query
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