Invention Grant
- Patent Title: Method of fabricating semiconductor device
- Patent Title (中): 制造半导体器件的方法
-
Application No.: US12466549Application Date: 2009-05-15
-
Publication No.: US07935636B2Publication Date: 2011-05-03
- Inventor: Takeo Ishibashi
- Applicant: Takeo Ishibashi
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2005-285012 20050929; JP2006-247496 20060913
- Main IPC: H01L21/28
- IPC: H01L21/28 ; H01L21/308

Abstract:
An insulating film is formed on a main surface of a substrate. A conductive film is formed on the insulating film. A lower layer resist film, an intermediate layer, an anti-reflection film and an upper layer resist film are formed on the conductive film. A focal point at a time of exposure is detected by detecting a height of the upper layer resist film. In detecting the focal point at the time of exposure, a focal point detection light is radiated on the upper layer resist film. After detecting the focal point, the upper layer resist film is exposed and developed thereby to form a resist pattern. With the resist pattern as a mask, the intermediate layer and the anti-reflection film are patterned, and the lower layer resist film is developed. With these patterns as a mask, the conductive film is etched thereby to form a gate electrode.
Public/Granted literature
- US20090227046A1 METHOD OF FABRICATING SEMICONDUCTOR DEVICE Public/Granted day:2009-09-10
Information query
IPC分类: