Invention Grant
- Patent Title: Thin film etching method
- Patent Title (中): 薄膜蚀刻法
-
Application No.: US11984760Application Date: 2007-11-21
-
Publication No.: US07935641B2Publication Date: 2011-05-03
- Inventor: Yeon-hee Kim , Jung-hyun Lee , Yong-young Park , Chang-soo Lee
- Applicant: Yeon-hee Kim , Jung-hyun Lee , Yong-young Park , Chang-soo Lee
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronic Co., Ltd.
- Current Assignee: Samsung Electronic Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce P.L.C.
- Priority: KR10-2007-0001578 20070105
- Main IPC: H01L21/302
- IPC: H01L21/302 ; H01L21/461

Abstract:
Example methods may provide a thin film etching method. Example thin film etching methods may include forming a Ga—In—Zn—O film on a substrate, forming a mask layer covering a portion of the Ga—In—Zn—O film, and etching the Ga—In—Zn—O film using the mask layer as an etch barrier, wherein an etching gas used in the etching includes chlorine. The etching gas may further include an alkane (CnH2n+2) and H2 gas. The chlorine gas may be, for example, Cl2, BCl3, and/or CCl3, and the alkane gas may be, for example, CH4.
Public/Granted literature
- US20080166834A1 Thin film etching method Public/Granted day:2008-07-10
Information query
IPC分类: