Invention Grant
- Patent Title: Spunbonded heat seal material
- Patent Title (中): 纺粘热封材料
-
Application No.: US10297573Application Date: 2001-06-12
-
Publication No.: US07935646B2Publication Date: 2011-05-03
- Inventor: Helen Viazmensky , John M. Allen , Richard T. Giovannoni
- Applicant: Helen Viazmensky , John M. Allen , Richard T. Giovannoni
- Applicant Address: US CT Windsor Locks
- Assignee: Ahlstrom Nonwovens LLC
- Current Assignee: Ahlstrom Nonwovens LLC
- Current Assignee Address: US CT Windsor Locks
- Agency: Alix, Yale & Ristas, LLP
- International Application: PCT/US01/40919 WO 20010612
- International Announcement: WO01/96639 WO 20011220
- Main IPC: B32B5/26
- IPC: B32B5/26
Abstract:
Disclosed is a nonwoven web material (10) comprising thermoplastic fibers or filaments and a method of manufacture thereof. The web material has properties desirable for use on machinery having conventional heat sealing stations (26). Also, disclosed is a nonwoven infusion web material comprising thermoplastic fibers or filaments and a method of manufacture thereof. The infusion web material has properties desirable for use in making infusion packages.
Public/Granted literature
- US20040018795A1 Spunbonded heat seal material Public/Granted day:2004-01-29
Information query
