Invention Grant
- Patent Title: Encapsulant layer for photovoltaic module, photovoltaic module and method for manufacturing regenerated photovoltaic cell and regenerated transparent front face substrate
- Patent Title (中): 用于光伏组件的封装层,光伏组件和用于制造再生光伏电池和再生的透明正面基板的方法
-
Application No.: US10936974Application Date: 2004-09-09
-
Publication No.: US07935884B2Publication Date: 2011-05-03
- Inventor: Kasumi Oi , Takaki Miyachi , Isao Inoue , Koujiro Ohkawa , Hiroki Nakagawa
- Applicant: Kasumi Oi , Takaki Miyachi , Isao Inoue , Koujiro Ohkawa , Hiroki Nakagawa
- Applicant Address: JP Tokyo-to
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo-to
- Agency: Ladas & Parry LLP
- Priority: JP2003-318544 20030910; JP2004-157847 20040527
- Main IPC: H01L31/04
- IPC: H01L31/04 ; C08F30/08

Abstract:
An encapsulant layer for a photovoltaic module enabling recovering and recycling or reusing of reutilizeable resources such as a transparent front face substrate and photovoltaic cell and the like among constituents of a photovoltaic module, and a method for manufacturing a regenerated photovoltaic cell and a regenerated transparent front face substrate. The photovoltaic module is formed by laminating: a transparent front face substrate; a photovoltaic cell carrying a wiring electrode and a takeoff electrode, and an encapsulant layer is placed on at least one surface; and a rear face protecting sheet. The encapsulant layer is a separable layer formed mainly of a thermoplastic resin, and an output maintenance factor of photoelectronic power of the photovoltaic module using the encapsulant layer is in a range of 80% to 100%.
Public/Granted literature
Information query
IPC分类: