Invention Grant
- Patent Title: Gas blocking, high temperature conductor-insulation adhesive
- Patent Title (中): 气体阻塞，高温导体绝缘胶
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Application No.: US12345228Application Date: 2008-12-29
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Publication No.: US07935890B2Publication Date: 2011-05-03
- Inventor: Jason Holzmueller , Mark A. Metzger , Gregory H. Manke
- Applicant: Jason Holzmueller , Mark A. Metzger , Gregory H. Manke
- Applicant Address: US TX Sugar Land
- Assignee: Schlumberger Technology Corporation
- Current Assignee: Schlumberger Technology Corporation
- Current Assignee Address: US TX Sugar Land
- Agent Kevin B. McGoff; Rodney V. Warfford
- Main IPC: H01B7/00
- IPC: H01B7/00
Abstract:
An adhesive composition includes 100 parts by weight of a polyolefin polymer derived from an olefin monomer copolymerized with at least one co-monomer that is different form the olefin monomer; 1˜100 parts by weight of an adhesion promoting agent comprising a polybutadiene polymer, which has a molecular weight of 1,000˜10,000 and has an anhydride group grafted thereon; 0.1˜5 parts by weight of an antioxidant; and 0.5˜15 parts by weight of a curative agent. An adhesive composition includes 100 parts by weight of a polyolefin polymer derived from an olefin monomer copolymerized with at least one co-monomer that is different form the olefin monomer, where in the polyolefin polymer comprises an anhydride group grafted thereon; 0.1˜5 parts by weight of an antioxidant; and 0.5˜15 parts by weight of a curative agent.
Public/Granted literature
- US20100163271A1 GAS BLOCKING, HIGH TEMPERATURE CONDUCTOR-INSULATION ADHESIVE Public/Granted day:2010-07-01
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